High Density Interconnects Support IoT Devices

As the Internet of Things (IoT) continues to infiltrate our daily tech, from the home thermostat and lightbulbs to the augmented reality headsets and fitness trackers, there’s one thing all these devices have in common: connectivity. This connectivity, which is made possible by high density interconnects (HDI), enables IoT products to collect and transmit data at rapid speeds, helping streamline processes on a large scale.

IoT device design is pushing the boundaries of traditional PCB construction, which requires an increased level of functionality and flexibility in small form factors. Fortunately, flex and high density interconnect PCBs can provide the needed performance and durability to ensure IoT devices are reliable in their application.

Printed Electronics (PE) is a cost-effective and versatile solution for IoT devices, as it provides flexibility, excellent copper tensile strength, and the ability to incorporate non-traditional shapes into the final product. The latter is especially critical for IoT applications, where the devices may be used in difficult environments or atypical uses such as deep-sea drilling.

How Do High Density Interconnects Support IoT Devices?

A high-density PCB is a multi-layer board that features small trace widths, small gap dimensions, and smaller vias. These improvements help reduce circuitry size and weight, allowing for greater power and data transmission within the board. It also helps reduce overall signal loss and crossing intervals. Additionally, these improvements can result in lower component gaps and higher transistor counts to help improve signal integrity.

The demands of IoT devices have pushed the limits of traditional PCB construction, resulting in a need for denser interconnects. This includes decreased semiconductor rise-times, which require smaller traces and pads. It also requires reduced via diameters and increased buried vias to increase signal density and reduce the size of the component footprint.

In addition, the IoT requires a high level of reliability, as it often works in challenging environments. This can include underwater, in extreme temperature ranges, or when it must be able to work with other devices from different manufacturers. This means that IoT devices must have the highest quality components and must be designed to withstand these conditions.

Aside from requiring higher reliability, IoT devices must be flexible and portable in order to meet their intended function. As such, a high-density PCB is an essential technology for IoT devices.

As the IoT continues to revolutionize industries and connect our physical world with our digital one, it’s crucial that all designers of IoT devices are on the same page throughout the entire design process. Ideally, mechanical, electrical, and HDI designers should work together to evaluate new forms, define the appropriate PCB material and thickness, and develop an efficient layout for assembly into a finished product. This will enable the IoT to continue to transform our lives for years to come.